Application of Vapor Deposition Perfluoroether Sealing Ring
Physical Vapor Deposition (PVD) technology refers to the technique of using physical methods to vaporize a material source – solid or liquid surface – into gaseous atoms, molecules, or partially ionize into ions under vacuum conditions, and depositing a thin film with a certain special function on the substrate surface through a low-pressure gas (or plasma) process. The main methods of physical vapor deposition include vacuum evaporation, sputtering coating, arc plasma coating, ion coating, and molecular beam epitaxy. Up to now, physical vapor deposition technology can not only deposit metal films, alloy films, but also deposit compounds, ceramics, semiconductors, polymer films, etc.
brief introduction
Physical vapor deposition technology had some applications as early as the early 20th century, but it has developed rapidly in the past 30 years, becoming a new technology with broad application prospects and moving towards an environmentally friendly and clean trend. Since the early 1990s, it has been increasingly widely used in the watch industry, especially in the surface treatment of high-end watch metal appearance parts.
The basic principle of vacuum evaporation plating is to evaporate metals, metal alloys, or compounds under vacuum conditions, and then deposit them on the surface of the substrate. The evaporation method is commonly used by resistance heating, high-frequency induction heating, electron beam, laser beam, and ion beam high-energy bombardment of the plating material to evaporate into a vapor phase, which is then deposited on the surface of the substrate. In history, vacuum evaporation plating is the earliest technology used in PVD method.
The basic principle of sputtering coating is to charge argon (Ar) gas under vacuum conditions, causing the argon gas to undergo glow discharge. At this time, the argon (Ar) atoms ionize into argon ions (Ar+). Under the action of electric field force, the argon ions accelerate the bombardment of the cathode target material made of the coating material, and the target material will be sputtered out and deposited on the surface of the workpiece. If direct current glow discharge is used, it is called direct current (Qc) sputtering, and radio frequency (RF) glow discharge caused by it is called radio frequency sputtering. Magnetron sputtering is caused by magnetron (M) glow discharge. The basic principle of arc plasma coating is to use an arcing needle to strike an arc under vacuum conditions, causing arc discharge between the vacuum gold wall (anode) and the plating material (cathode). Multiple cathode arc spots move rapidly on the cathode surface, constantly evaporating or even “sublimating” the plating material, causing it to ionize into an arc plasma with the plating material as the main component, and quickly depositing the plating material on the substrate. Due to the presence of multiple arc spots, it is also known as the multi arc evaporation ionization process.
The basic principle of ion plating is to use a certain plasma ionization technology under vacuum conditions to partially ionize the atoms of the plating material into ions, while generating many high-energy neutral atoms and applying negative bias voltage to the substrate being plated. Under the action of deep negative bias, ions deposit on the surface of the substrate to form a thin film. The basic principle of physical vapor deposition technology can be divided into three process steps: (1) gasification of the plating material: even if the plating material evaporates, undergoes sublimation or sputtering, it is through the gasification source of the plating material. (2) Migration of atoms, molecules, or ions in the plating material: Various reactions occur after the collision of atoms, molecules, or ions supplied by the gasification source. (3) Atoms, molecules, or ions of the plating material are deposited on the substrate.
physical